Panacol-Elosol GmbH is an internationally active provider in the growth market of industrial adhesives. Its extensive product range includes UV adhesives, structural adhesives and conductive adhesives. These innovative adhesives are developed by its in-house research department and manufactured at its own production sites in Germany and the USA. Panacol develops state of the art quality adhesives and is ISO 9001 certified since 2002. Panacol offers customer-oriented solutions and expert consulting on adhesive technology and applications throughout the world: In addition to subsidiaries in France (Eleco-EFD), the USA (Panacol-USA Inc.), China (Hoenle UV Technology (Shanghai) Trading Ltd.) and Korea (Panacol-Korea Co., Ltd.), a worldwide network of distributors ensures efficient sales and personal contacts wherever customers are located. Panacol serves customers in the automotive, aerospace, optics, electronics and consumer electronics industries as well as manufacturers of luxury packaging, household appliances, medical technology and medical devices throughout the world. Panacol-Elosol GmbH was founded in 1978 in Frankfurt am Main as a German subsidiary of Panacol AG in Switzerland. Since January 2008, Panacol has been a member of the Hönle Group. Together with Dr. Hönle AG – the parent company of the Hönle Group and a global leader in industrial UV technology – Panacol is a reliable systems provider for bonding technology complete with suitable curing systems. In the Spring of 2009, Panacol took over the adhesives and sealant sales operation for the entire group as well as Hönle’s other subsidiary Wellomer GmbH, making Panacol a leader in industrial adhesives. With the expansion of its R&D, application technology and production operations, 2009 also saw the company’s relocation from Oberursel – where Panacol had been headquartered since 1993 – to the neighbouring town of Steinbach. A further move, this time within Steinbach, is planned for the summer of 2020 and will afford Panacol more office, laboratory and production space.