Nihon Genma

The winDot series of solder paste was designed specifically for high speed jetting and also for extremely small dispensing applications.

Nihon Genma

Nihon Genma has been developing and producing solder paste for electronics assembly since 1948.  With over 110 dedicated employees, Nihon Genma developed and released solder paste designed specifically to work with jetting or other dispensing technologies to answer market needs for ultra fine dispensing of solder paste.  With the winDot series of jettable solder paste, Nihon Genma is enabling future production processes now.

Contact us for more information.

Applications overview

Solder paste developed specifically for small dot dispensing or jetting.  Nihon Genma has been able to develop solder paste that can dispense repeatably without clogging for 24 hours.  There are 2 basic types: SAC305 and SiBi58 for low temperature soldering.

The main applications are:

  • Type 7 paste with a particle size range of 2 – 11um and flux concentration specially formulated for jetting.
  • F-005 is designed to jet a dot diameter of 150um to 250um.
  • F-005 even with a particle size of 2 – 11um has a 24 hour pot life after acclimatization.
  • F-005 is available with various flux types.
  • Type 6 paste with a particle size range of 5 – 15um and flux concentration specially formulated for jetting.
  • B-005 is designed to jet a dot diameter of 250um to 330um.
  • B-005 even with a particle size of 5 – 15um has a 24 hour pot life after acclimatization.
  • B-005 is available with various flux types.
  • Type 5 paste with a particle size range of 10 – 25um and flux concentration specially formulated for jetting.
  • S-005 is designed to jet a dot diameter of 320um to 500um.
  • S-005 even with a particle size of 10 – 25um has a 24 hour pot life after acclimatization.
  • S-005 is available with various flux types.
  • SnBi58 for a low melting point solder that is capable for jetting. Melting point is 139C.
  • Pot life of 24 hours
  • Type 5 paste with a particle size range of 10 – 25um and flux concentration specially formulated for jetting and laser reflow
  • S-005 L is designed to jet a dot diameter of 320um to 500um.
  • B-005 even with a particle size of 10 – 25um has a 24 hour pot life after acclimatization.
  • B-005 is available with various flux types.

Nihon Genma brochures:

winDot F-005 brochure

Typical Applications:

  • Solder paste jetting in place of printing for prototype lines, R&D lines
  • Solder paste jetting on wafer or chip to form solder bumps
  • Solder paste jetting for extremely small chip sizes such as 0402 and 0603 (metric)
  • Solder paste jetting into cavity substrates
  • Solder paste jetting on PCB for fine pitch LGA devices
  • Solder paste jetting on cavity packages where printing is not possible
  • Solder paste jetting on 3D electronics
  • Solder paste jetting for lid attach
  • Solder paste jetting after printing to add solder paste to critical positions

About Us

Nihon Genma winDot series paste

Nihon Genma Mfg. Co., Ltd was established in 1948 and is renowned around the world for their various solders pastes, solder bars, flux cored solder wires and other products for the electronic assembly markets. Nihon Genma, recognizing the growing solder paste for dispensing market, teamed up with winD Inc., Company, introduced the winDot series of solder paste specifically developed for solder paste jetting. winDot consists of several engineers with specialist electronics assembly experience and know-how. Based on their experience and knowledge the winDot series solder paste for jetting was developed. The winDot series paste has been confirmed by numerous jet dispensing system manufacturers as the best jettable solder paste on the market.