TPT

HB 70

The HB 70 is a new development at TPT and is a manual die bonder. It can accommodate both dispensing and stamping of epoxy. It also includes a tiltable full HD camera for excellent viewing angles and can also be used for close inspection. Optional heater stages are also available.

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HB 05

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Like all TPT wire bonders the manual HB 05 can handle Au, Ag, Cu or Al wire from 17um to 75um or ribbon up to 25x250um. All of these can be handled by only changing the tool, no head change is necessary. The HB 05 includes a 4″ TFT display with push dial for easy programming. The TPT wire bonder is the most flexible manual wire bonder on the market today.

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HB 10

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The HB 10 (automatic Z axis) is advanced and is a very flexible semi-automatic wire bonder. Like the HB 05 the HB 10 can bond Au, Ag, Cu and Al wire (17um to 75um) or ribbon (up to 25x250um) by only changing the tool. No modifications to the head are necessary. With a 6.5″ touch panel providing a quick and efficient software interface, any program can be easily made or modified.

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HB 16

The HB 16 (motorized Y and Z axis) is advanced and is a very flexible semi-automatic wire bonder. Like the HB 05 the HB 16 can bond Au, Ag, Cu and Al wire (17um to 75um) or ribbon (up to 25x250um) by only changing the tool. No modifications to the head are necessary. With a 6.5″ touch panel providing a quick and efficient software interface, any program can be easily made or modified.

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HB30

The HB 30 is a flexible semi-automatic heavy wire bonder capable of wedge bonding 100um wire up to 500um wire or 300 x 2000um ribbon. To change from wire to ribbon or vice versa on the tool and knife needs to be changed. No modification to the head is necessary. With a 6.5″ touch panel producing or modifying programs is simple and easy.

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Extension Kits

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TPT also has a full range of extension kits to further enhance the usability of their wire bonders. These kits include a die attach kit, a bond pull test kit, various video and camera kits, various size and shapes of work holders with temperature control and others. Wire bond kits including wire and tools are also available.

HB 100

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The HB 100 is a new generation of automatic desktop wire bonders. It performs wedge- and ball-bonding with one bond head. The HB 100 is very easy to handle with a touch screen and joystick. The software strongly supports the user with process guidance and bond assist features.

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