TPT

HB100 Automatic wire bonder
Full automatic wire bonder that is very flexible. Ball bonding, wedge bonding, ribbon bonding and stud bumping all possible with tool change only.
HB100 Automatic wire bonderH47 Copper Ball Bonding Kit

TPT Wire Bonder

TPT Wire Bonder is an owner-managed company that develops and manufactures semi-automatic wire bonder with over 30 years of experience in wire bonding technology. TPT bonders stand out with intuitive operation, innovation an optimal performance. TPT have been successfully selling bonders to more than 40 countries worldwide and have partners in many countries that provide technical support and service. TPT’s customers include the world’s leading companies and universities.

Key Advantages

1) Extremely flexible wire bonding systems: all TPT wire bonders can change from wedge bonding to ball bonding by simply changing the tool
2) Easy to use and easy to program
3) Over 30 years of wire bonding experience
4) Located in the high tech area near Munich

• Wire bonder with motorized Z and Y-axis

          

• Automatic wire bonder with motorized X, Y, and Z-axis

          

• Heavy wire bonder with motorized Z-axis

          

• Manual Wire Bonder

          

• Wire Bonder with automatic Z-axis.

          

• Semi-automatic die bonder with motorized Z-axis

          

TPT Current Models

TPT wire bonders are made in Germany and are used in the development and production of microchips.
Contact us for more information.

Applications

• Wedge Bonding
• Ball Bonding
• Ribbon Bonding
• Bump Bonding
• Coated Wire Bonding
• Insulated Wire Bonding
• Copper Bonding
• Heavy Wire Bonding 

Click on the links to learn more.

ENQUIRY