Holdwell

99.99% Au wire for both ball – wedge bonding and wedge – wedge bonding available, from 0.5mil to 2mil diameters.

Holdwell

Since our foundation in 2008, we have strived to create excellent quality bonding wire products for the world electronics assembly market. We have rapidly grown our production capabilities while at the same time increased our product portfolio to include most types of wire used in wire bonding throughout the world presently. We also have all the usual Quality Control equipment sets and methodologies in place necessary to ensure products of exceptional quality.

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Applications overview

There are many different types of wire used in wire bonding currently. Please find our types below:

  • 99.99Au wire used for both ball bonding and wedge bonding. Available in both 2” and ½” spools.
  • Au80Ag20 wire is also available, this wire also can be used for both ball and wedge bonding. No gas is needed typically. 2” spools only.

Other wire size or specification available upon request

Quotation Information

1. Wire Type : Gold
2. Wire Size : 30um / .2mil
3. Wire composite : 99.99%
4. Packaging size : 0.5″ / 2″ / 2″ Wide
5. Wire length /spool : 300m / 1000Ft
6. Price/ per meter or foot : USD / spool / 300m
7. Payment Term : Standard Payment
8. Lead time : 4 weeks or less
9. payment mode : Ex-works Axend Singapore
  • Al 1% Si wire, standard thin wire with 1% silicon doping, 2” and ½” spools available

  • 99.99Al + Ni doped heavy aluminium wire typically used for power semiconductor bonding. Available in both 4” and 88 or 88L spools
  • 99.999Al wire for power semiconductor bonding. Available in both 4” and 88 or 88L spools
  • 99.99Al + Ni doped heavy aluminium ribbon. Available in both 4” and 88 or 88L spools



  • Bare Cu wire and CuPd plus CuPdAu wires are available in 2” or 2” wide spools


  • Both 88Ag and 96Ag are available in both 2” and 2” wide spools


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