The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations. This system is designed to be compatible with the most commonly used work holders and tooling, that you may already have in stock.
Condor Sigma 150HF
With the Condor 150 HF, XYZTEC offers a unique 500kgf force driving platform for measuring all kinds of horizontally and vertically tested bonds, using pull, peel, push or shear methods; either destructive or non-destructive, while maintaining superior frame stiffness. Typical applications include flip-chip die shear testing, power module bond testing as well as full automatic testing.
Condor Sigma W12
The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the tool and cameras in record speed.
Condor Sigma Lite
XYZTEC’s Condor Sigma Lite gives you a low cost entry point without sacrificing performance to meet future demands. The Condor Sigma Lite is upgradeable to the specifications of the regular Condor Sigma and beyond. Whether you need a dedicated or multipurpose bond tester, the Condor Sigma platform is the best choice featuring unparalleled accuracy, the best ergonomics, highest throughput, maximum flexibility and the lowest cost of ownership.