Axend offers various prototype assembly services. These services are designed for the assembly of prototypes and small volumes between 1-200 units (approximate). Please find our capabilities below.
Because each application is different, please contact us to discuss the details and we will give you a quotation as soon as possible.
Typical example applications are: LED Die attach and wire bond, Laser attach and wire bond, Au or Al ribbon bonding, TO based packages, various photonics assemblies, butterfly packages, etc.
1. Pick from 2″ waffle/gel pack
2. Manual alignment
3. Dispensing or stamping capability for die attach material
4. Cure in place by UV possible
5. Thermal cure also possible
6. Pick-up by rubber tip or collet possible
1. TPT HB16 wire bonder
2. Au ball-wedge, Au wedge-wedge, Al wedge-wedge, BSOB, Au or Al ribbon bonding, Au stud bumping
3. Ball-wedge bonding = 17.5μm to 50μm wire
4. Wedge-wedge bonding = 17.5μm to 75μm
5. Ribbon bonding up to 25 x 250μm