MEGTAS

Find innovative MEGTAS Capillaries solutions here. We are a distributor for MEGTAS Co., Ltd., leading manufacturer of bonding capillary for semiconductor and LED.

MEGA-GP

Megtas Capillaries

MEGA-GP is MEGTAS’ longest lasting capillary, and will last an average of two million bonds.

Features

– Smaller microstructure and higher density

– Less contamination and build-up

– Effective parameter transfer

– Longer usage

Material Properties
Item Data
Density (g/cm3) 4.4
Hardness (Hv) Avg. 2,100
Grain size (µm) <0.3µm
Toughness (Mpa) 7.5~7.9
Forming Method Press

 

Mega-AP

Megtas capillary

Mega-AP is a capillary molded by MEGTAS ceramic injection technology. Mega-AP is a wear-resistant and long life wire bonding capillary.

Features

– Resistant to contamination

– Various tip finish solutions

– Longer life span

– Effective parameter transference

Material Properties
Item Data
Density (g/cm3) 4.3
Hardness (Hv) Avg. 2,100
Grain size (µm) 0.5µm
Forming Method Injection

Mega-Cu

Mega-Cu capillary is specially designed for Cu wire bonding. Mega-Cu is an effective solution against splashing of Cu wire bonds.

CPM

CPM is a capillary suitable for fine-pitch bonding. It is manufactured by optimized sintering process and a combination between alumina and zirconia. Various tip finish solutions are available to meet specific customer needs.

Features

– Various tip finish solutions

– Excellent bond-ability and life span

– High productivity

Material Properties
Item Data
Density (g/cm3) 4.2
Hardness (Hv) Avg. 1,750
Grain size (µm) 0.9µm
Forming Method Press

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