Die Bonding & Component Placement
1. Plasma Treatment
In order to achieve best bonding results, plasma surface treatment may be necessary.
2. Adhesive Selection
Panacol develops and manufactures a very broad range of adhesives both conductive and nonconductive. Thermal and UV curable.
3. Dispensing Technology
Select best dispensing method and needles to have most efficient process, metal and ceramic needles available.
4. Die Bonding & Component Placement
Select best die bonder or component placement system. MAT manufactures high and high flexibility systems
5. UV Curing
Select UV or Thermal curing. Hoenle provides broadest range of lamp and LED curing devices in the world.