Adhesives, Encapsulants, Underfills, Masking, Medical Grade Adhesives and Others
Adamant produces HIP ceramic, sapphire and ruby bonding capillaries.
Manual and Semi-automatic Wire & Die Bonders and Automatic Wire Bonders
Nihon Genma has been developing and producing solder paste for electronics assembly since 1948.
High Precision Dispensing Needles and Auger Valves
UV Lamp and UV LED systems for adhesive curing, ink curing, solar simulation and others
Ultrasonic Wedge Bonding Tools for thin wire, heavy wire and ribbon
Automatic High Accuracy and High Flexibility Die Attach and Component Placement Systems
Handheld and High-powered Atmospheric Plasma Surface Treatment Systems
Prototype solutions for electronic assembly packaging
Axend provides integrated dispensing solutions for all types of dispensing applications.
Holdwell is strived to create excellent quality bonding wire products for the world electronics assembly market
Automatic Bond Testers for wire pull, shear, peel, tweezer pulls and many other tests
F&K Ultrasonic Bonder Diagnosis Systems for Preventive Maintenance or Process Optimisation
Laserssel has been developing laser reflow solutions from 2012 as a part of Crucialtec.