MAT
Model 6400
Features: Flexible, fully automatic high accuracy (3um @ 3 sigma, process dependent) die attach system controlled by user friendly Windows XP® based software, performs cold and hot processes for MCM, Flip Chip, Eutectic, and Ultrasonic assemblies, handles active and passive components with sizes between 0.2 mm up to over 25 mm
Model 6410
Features: The system performs Dispensing and Stamping of different adhesives, flux and other materials in the same application,the adhesive is applied in single dot, multi dot and X-Y shape patterns by the Time-Pressure or Positive Displacement Pumps, a library of complex pre-taught dispense and stamp shapes allows fast and easy set-up of the application.
Model 6200
Features: The Model 6200 allows for the widest range of cold and heated die attach processes on the same machine. The process capabilities implemented into the 6200 include: Epoxy die attach, different eutectic processes, GGI based on ultrasonic or thermo-compression processes, Ag sintering, die Stacking and many other processes.
