Features: Flexible, fully automatic high accuracy (3um @ 3 sigma, process dependent) die attach system controlled by user friendly Windows XP® based software, performs cold and hot processes for MCM, Flip Chip, Eutectic, and Ultrasonic assemblies, handles active and passive components with sizes between 0.2mm up to over 25mm. Pick from waffle/gel pack, wafer and reel feeders all in one program.
Features: The Model 6410 MAT die bonder system can perform both Dispensing and Stamping of different adhesives, flux and other materials in the same application, the adhesive is applied in single dot, multi dot and X-Y shape patterns by a Time-Pressure or Positive Displacement Pump, a library of complex pre-taught dispense and stamp shapes allows fast and easy set-up of the application. The 6410 system can dispense or stamp with a 10um @ 3 sigma accuracy. The highest accuracy of any dispenser on the market.
Features: The Model 6200 MAT die bonder allows for the widest range of cold and heated die attach processes on the same machine. The process capabilities implemented into the 6200 include: Epoxy die attach, different eutectic processes, GGI based on ultrasonic or thermo-compression processes, Ag sintering, die Stacking and many other processes.