F&K Physiktechnik

F&K Physiktechnik GmbH develops and manufactures products used world wide for chip interconnection in microelectronic production. The company focus is mainly in ultrasonic technology such as ultrasonic generators and ultrasonic transducers for wire and flip chip die bonding, as well as test and measurement equipment to characterize and set up ultrasonic systems of bond machines.

Transducer Test Systems

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With the transducer test system, or the TTS, it is possible to detect faulty transducers before they are integrated into the bond machine. By using the TTS the user can save cost and time by being able to spot the reasons for ineffective bond results. The optical displacement measurement systems of the ODS series are specially designed for measuring the ultrasonic vibration displacement at bond tools of wire & flip-chip die bonders.

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Optical Displacement Measurement Systems

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The optical displacement measurement systems of the ODS series are specially designed for measuring the ultrasonic vibration displacement at bond tools of wire & flip-chip die bonders. The systems are highly accurate and easy to use.

Download ODS-20 Data Sheet

Download ODS-21 Data Sheet

Alignment Laser

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These bi-directional alignment lasers allow for quick & easy adjustments of optical experiments and optical sets.

Download Data Sheet