Axend

<>/div>

Adhesives, Encapsulants, Underfills, Masking, Medical Grade Adhesives and Others

Orbray produces HIP ceramic, sapphire and ruby bonding capillaries.

Manual and Semi-automatic Wire & Die Bonders and Automatic Wire Bonders

Nihon Genma has been developing and producing solder paste for electronics assembly since 1948.

High Precision Dispensing Needles and Auger Valves

UV Lamp and UV LED systems for adhesive curing, ink curing, solar simulation and others

Ultrasonic Wedge Bonding Tools for thin wire, heavy wire and ribbon

Automatic High Accuracy and High Flexibility Die Attach and Component Placement Systems

Handheld and High-powered Atmospheric Plasma Surface Treatment Systems

Prototype solutions for electronic assembly packaging

Axend provides integrated dispensing solutions for all types of dispensing applications.

Holdwell strives to create excellent quality bonding wire products for the world electronics assembly market

Automatic Bond Testers for wire pull, shear, peel, tweezer pulls and many other tests

F&K Ultrasonic Bonder Diagnosis Systems for Preventive Maintenance or Process Optimisation

Laserssel has been developing laser reflow solutions from 2012 as a part of Crucialtec.